Siemens Digital Industries Software has announced that it has deepened its longstanding collaboration with TSMC to drive innovation in semiconductor design and integration.

Building on a series of recent collaborations, Siemens has achieved certification for its Calibre nmPlatform software suite - including nmDRC, nmLVS, YieldEnhancer and PERC tools - alongside its Analog FastSPICE (AFS) and Solido solutions, for TSMC’s N2P and A16 processes.

In addition, its Calibre 3DSTACK solution is certified for TSMC’s 3DFabric technologies and the 3Dblox standard, advancing silicon stacking and packaging design. Siemens and TSMC are also advancing tool certifications for the newly announced TSMC N3C technology, building on the available N3P design solutions – both have also initiated collaboration on design enablement for TSMC’s newest A14 technology, laying the groundwork for next-generation designs.

The Siemens and TSMC partnership will help to significantly advance system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications, due in part to recent technology achievements that include:

Siemens’ signature Calibre nmPlatform software is now certified for TSMC’s most advanced processes - Calibre nmDRC software, Calibre nmLVS software, Calibre PERC software, and Calibre YieldEnhancer software with SmartFill technology are all certified for TSMC’s advanced N2P and A16 processes, enabling mutual customers to continue accessing state-of-the-art signoff technology.

Siemens’ Calibre xACT software is certified for the newest version of TSMC’s N2P process. As the 3Dblox technology continues its transition to become an IEEE standard, Siemens and TSMC have successfully collaborated to certify Siemens’ Calibre 3DSTACK solution’s support for 3Dblox and TSMC’s 3DFabric technologies.