Siemens and GlobalFoundries (GF) have announced a strategic collaboration aimed at integrating artificial intelligence (AI) into semiconductor manufacturing processes to improve efficiency, security and reliability across advanced industries. Under a newly signed memorandum of understanding, the two companies will focus on automation technologies for semiconductor fabrication, electrification, and digital solutions spanning chip design to product lifecycle management. The partnership seeks to deploy AI-enabled software, sensors and real-time control systems within fabrication plants to meet rising global demand for semiconductors and autonomous platforms.

The initiative includes centralised automation and predictive maintenance designed to boost equipment availability and operational efficiency. Both firms plan to implement these solutions within their own operations while developing offerings that can be scaled to other sectors. The collaboration comes amid surging demand for semiconductors in critical areas such as artificial intelligence, defence, energy and connectivity. Siemens and GF aim to strengthen supply chain resilience and accelerate innovation in next-generation chip technologies.

"Our economy runs on silicon – one wafer at a time. Chips are critical for applications like robotics or connectivity and for bringing AI into the physical world and industry,” said Cedrik Neike, Member of the Managing Board of Siemens and CEO of Digital Industries. “We are collaborating to make global semiconductor supply chains more resilient and to enable efficient, localised manufacturing around the world.”

Tim Breen, CEO of GlobalFoundries, added, “Secure, locally manufactured semiconductors are at the core of the AI transition – from cloud to the physical world, bringing intelligence into devices we use every day and enabling applications we couldn’t imagine a few years ago. Our unique collaboration with Siemens allows us to go faster – to build the technologies that make this possible – differentiated, energy-efficient, connected and secure chips across a wide range of next-generation applications.”

Siemens will contribute its portfolio of industrial automation, energy management and digitalisation technologies, including advanced software for chip design, fab automation and lifecycle management. GF, alongside its subsidiary MIPS – a leader in RISC-V processor IP – will provide process technology and design expertise to accelerate development of tailored solutions supporting autonomous platforms and physical AI chips at scale.