The newly released components feature a top‑side cooled surface‑mount design, intended to simplify heat management in systems where thermal constraints can limit performance. By enabling a direct thermal path between the semiconductor die and an external heatsink, the packaging approach reduces dependence on the printed circuit board for heat dissipation and allows designers to manage thermal and electrical aspects more independently.

The devices are available in both industrial‑grade and automotive‑qualified versions, with on‑resistance (RDS(on)) options of 17, 30, 40, 60 and 80mΩ. This range is intended to support applications spanning high‑power systems and more compact designs with strict thermal and mechanical requirements.

According to Nexperia, the QDPAK format addresses a common limitation in high‑voltage power conversion systems, where heat removal through the PCB can restrict overall performance. Compared with conventional D2PAK‑7 packaging, the company states that top‑side cooled solutions can enable up to 3kW higher output power under similar thermal conditions, while offering significantly greater thermal headroom.

The company also noted that, building on its X.PAK platform, the QDPAK design extends power handling capabilities further, allowing operation at higher power levels while maintaining comparable case temperatures.