The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

South Korea’s SK hynix has held a groundbreaking ceremony for an advanced packaging production facility for AI memory in West Lafayette, Indiana. The Indiana fab, with a total expected investment of over USD 4 billion, is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029, SK hynix said in a press release.

An “Advanced Packaging R&D Testbed” will be built alongside the production lines, enabling customers, universities, and business partners to collaboratively develop next-generation packaging technologies and rapidly execute prototype fabrication and performance validation. “SK hynix’s historic investment in West Lafayette is further proof that Indiana is leading the way in rebuilding America’s semiconductor industry,” said US Senator Todd Young. “This project will create good-paying jobs, strengthen our national and economic security, and ensure the technologies of the future are developed and manufactured here in the United States.” 

"This project will usher in the next generation of American innovation, bring thousands of good-paying jobs to Indiana and supercharge regional economic development,” said Indiana Governor Mike Braun. At the groundbreaking ceremony, SK hynix also signed an MOU with Purdue University for research and development collaboration in the field of advanced packaging. Through the MOU, both parties will strengthen R&D cooperation and will jointly research system integration and advanced packaging technologies, including HBM, the press release said.