Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.

Valens Semiconductor, an Israeli provider of high-performance connectivity chipsets, has announced a collaboration with US-based semiconductor company onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration the parties intend to give OEMs and Tier 1s a faster path to A-PHY.

Under the agreement, Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies, according to a press release.

"This is a major milestone for Valens, MIPI A-PHY and for the automotive ecosystem as a whole,” said Yoram Salinger, CEO at Valens Semiconductor. “The integrated, cost-optimized 3MP offering complements Valens' existing solutions, bringing A-PHY to a much broader range of use cases. Just as importantly, by collaborating with onsemi, another major supplier of A-PHY silicon, we are strengthening the ecosystem and giving automakers the supplier choice they expect from an industry standard.”