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INDUSTRY NEWS
07
2024-05
Infineon has confirmed it will supply its HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi until 2027
06
2024-05
The Italian government is set to plough EUR 10 billion into its domestic chip industry this year
29
2024-04
Vietnam commits $1.08bn to train 50,000 chip engineers by 2030
23
2024-04
TTI Europe Celebrates Winning the Molex 2023 European Distributor of the Year Award
22
2024-04
SK hynix signed an Memorandum of Understanding with TSMC for work together on next-generation HBM
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